Boiling point (1) | ![]() |
Flammability (1) | ![]() |
Melting point (1) | ![]() |
Thermal conductivity (2) | ![]() |
Thermal expansion (6) | ![]() |
Vapor pressure (1) | ![]() |
surface smoothness and thermal expansion.""You don't want it to expand or shrink too much. Wood is a natural hydroscopic material
CNF actually has a relatively low thermal expansion coefficient.""The group's work also demonstrates a more environmentally friendly process that showed performance similar to existing chips.
However the lifetime of this kind of component is reduced greatly due to the fact that the thermal expansion coefficients of these elements are significantly different from that of silicon.
and has relatively low thermal expansion coefficient, which means the material won't change shape as the temperature changes.
surface smoothness and thermal expansion. ou don want it to expand or shrink too much. Wood is a natural hydroscopic material
CNF actually has a relatively low thermal expansion coefficient. The group work also demonstrates a more environmentally friendly process that showed performance similar to existing chips.
< Back - Next >
Overtext Web Module V3.0 Alpha
Copyright Semantic-Knowledge, 1994-2011